Wafer-Level Packaging (WLP) vs Flip-chip (FC)

wafer level packaging vs flip chip

How do electronic devices keep getting smaller and lighter? The word on the street is, that this is all happening due to “Fan-out Wafer level packaging!” Another term that you always hear with Wafer-Level packaging is Flip chips (for those who are hearing it for the first time, Flip chips are used in making Integrated circuits (IC), Infrared sensors, optical devices etc.

However, a professional in industries like mobile communication and commercial real estate (CRE) might require a full understanding of the nuances of semiconductor packages and technologies like Wafer-Level Packaging (WLP) and Flip-Chip (FC). So let’s dive deeper into understanding the functionality of Wafer-Level Packaging (WLP) and Flip-Chip (FC) together with critical concepts like wafer dicing service, chip bonding, and assembly packaging.

Wafer-Level Packaging

In a nutshell, Wafer-Level Packaging is the art of packaging a semiconductor device while it is still part of the wafer. This technology is a huge victory for the domain of assembly packaging. WLP plays a major role in minimising the size and weight of the semiconductor package – allowing small electronic devices such as sensors in IoT applications or mobile devices to enhance their compactness, efficiency and performance.

WLP is also increasingly linked with wafer dicing services. Wafer dicing is the process of separating a wafer into ‘dies’ or individual chips following the completion of the semiconductor device’s fabricating process. With WLP, this process is notably efficient and contributes to the reduced cost and time associated with WLP.


Flip-Chip (FC), also known as “direct chip connect,” facilitates a direct electrical connection of the face-down ‘flipped’ chip with the carrier or board via conductive bumps. Flip-chip is best known for its high-frequency operation capability, thanks to the shorter electrical path that effectively lowers inductance and resistance.

One of the key processes contributing to the success of Flip-chip is Chip bonding. Chip bonding is a method of attaching the packaged chip to the substrate. This might involve wire bonding or the use of adhesives, depending on the type of chip and connection required. The result is a high-performing, reliable connection highly sought after in command-and-control applications. Here is what you need to know about WLP and Flip-Chip to understand what best suits your requirements.

WLP and FC, both offer significant benefits when it comes to wafer dicing services, chip bonding, and assembly packaging.

Space Efficiency – Both WLP and FC are popular choices when dealing with compact, high-density applications where ample space is a luxury.

Cost and Performance – WLP’s streamlined processes and integration with wafer dicing services make it a cost-effective solution. Meanwhile, FC, although somewhat pricier due to the complexity of the chip bonding process, delivers excellent performance, making it ideal for high-frequency applications.

Availability – With both WLP and FC established as vital technologies in the electronic industry, their availability isn’t much of a concern for application in various fields.

Complexity – WLP is a simplified assembly packaging method compared to FC. Still, the advanced chip bonding process in flip-chip packaging enables it to handle numerous complex tasks more efficiently, affording a broader range of applications.

The most important step to follow when determining between WLP and FC for your project is choosing a TRUSTED EXPERT with adequate experience in the field of IC packaging!

Maintaining precision, high quality and lead time Intech technology has proven to be the ideal partner to discuss your needs in wafer dicing services, chip bonding, and assembly packaging. Contact us today to discuss how your project could be optimized, efficient, and cost-effective solutions in a world increasingly defined by technological transformation using IC packaging solutions.


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