Insights
Reliability Services
Intech Technologies International specializes in cutting-edge plastic packages, providing reliable...
Plastic Packages
Intech Technologies International specializes in cutting-edge plastic packages, providing reliable...
Open Cavity/ Air cavity Packages
We specialize in the assembly of open cavity packages, ensuring...
Lid Assembly & Package Sealing Services
Intech Technologies International specializes in Lid Assembly & Package Sealing...
Epoxy Encapsulation Services
Intech Technologies International excels in Epoxy Encapsulation services, delivering robust...
Low-K Laser Grooving Solutions
Intech Technologies International revolutionizes semiconductor packaging with cutting-edge Low-K Laser...
Quad Flat No Lead Package (QFNL)
INTECH offers standard backgrinding and bumped wafer backgrinding. We use...
Low Profile Quad Flat Package (LQFP)
INTECH offers standard backgrinding and bumped wafer backgrinding. We use...
Die Shear | Wire Pull
The shear system has a unique ‘programmable shear height’ feature...
X-Ray
To further enhance failure analysis where the product has been...
SEM
SEM (Scanning electron microscope) provides our customer with failure analysis...
Flip Chip Bonding
As the trend of consumer products is driven towards the...
Wire Bonding Services
Intech Technologies International provides top-tier Wire Bonding services, employing state-of-the-art...
Die Attach & Die Bonding Services
Intech Technologies International offers exceptional die attach & die bonding...
Die Sorting Services
Intech Technologies International offers top-notch Die Sorting services, employing state-of-the-art...
Packaging Molding (Encapsulation)
• To complement our wafer dicing, INTECH also offers automated...
