Open Cavity/ Air cavity Packages

We specialize in the assembly of open cavity packages, ensuring the encapsulation of integrated circuits (ICs) for optimal performance and protection.
wire bonding Process

We specialize in the assembly of open cavity packages, ensuring the encapsulation of integrated circuits (ICs) for optimal performance and protection. Our expertise extends beyond package assembly to include lid assembly, providing a complete solution for encapsulation needs.

Working with ceramic and plastic materials, we carefully construct open cavity packages that offer excellent thermal dissipation, electrical insulation, and mechanical strength. Whether it’s managing heat efficiently with ceramic packages or cost-effective solutions with plastic packages, we tailor our approach to meet specific requirements.

Additionally, we excel in lid assembly, a critical step in encapsulation. Our skilled technicians meticulously align and securely attach the lid to the package, ensuring the protection and integrity of the delicate die and wire connections. With precise adhesives or soldering techniques, we create a robust seal against environmental factors and contaminants.

Our open cavity package assembly, combined with meticulous lid assembly, delivers a comprehensive solution for encapsulating ICs. Whether you require encapsulation for low volume jobs or larger projects, our focus on quality and attention to detail ensures reliable and high-quality results.

Package Assembly Process:

Our package assembly process includes essential steps to ensure the successful encapsulation of integrated circuits (ICs) within open cavity packages. Here is an overview of the key stages involved:

Die Attach:

During this crucial step, the IC die is precisely attached to the open cavity package. Utilizing advanced techniques and equipment, we ensure accurate alignment and secure bonding between the die and the package. This step establishes reliable electrical connections and sets the foundation for optimal IC performance.

Wire Bonding:

Next, we establish essential electrical connections between the die and the package leads. Our experienced technicians employ advanced wire bonding techniques, such as wedge bonding or wire bonding, to establish secure and robust electrical connections. This ensures efficient signal transmission and functionality of the IC.

Encapsulation (Lid Assembly):

The encapsulation stage involves sealing the open cavity package to protect the delicate die and wire connections from external contaminants and environmental factors. The lid assembly process is carried out with meticulous care, aligning and securely attaching the lid to the package. Through precise adhesives or soldering techniques, we create a robust seal, ensuring the integrity and longevity of the encapsulated IC.


To enable easy identification and traceability, we incorporate a marking process that ensures clear and permanent identification on the package surface. Through advanced laser marking technology, we imprint relevant information such as part numbers, lot codes, and manufacturer logos onto the package. This meticulous marking process guarantees accurate identification and seamless integration into inventory management and quality control systems.

At every stage of the package assembly process, we prioritize quality control and utilize state-of-the-art equipment to ensure precision and reliability. Our skilled technicians possess extensive expertise in package assembly, enabling us to deliver high-quality encapsulation solutions tailored to meet the specific requirements of our customers.

Please note that our package assembly process may vary depending on the project requirements and package type. We are committed to adapting our processes to accommodate your unique needs and deliver exceptional results.

Open Cavity Package Types:

Our comprehensive package assembly services cover a broad range of open cavity package types. Alongside the well-known CSP (Chip Scale Package) and WLP (Wafer-Level Package), we specialize in assembling the following popular package types:

QFN (Quad Flat No-Lead)

DFN (Dual Flat No-Lead)

SON (Small Outline No-Lead)

MLP (Micro Leadframe Package)

LGA (Land Grid Array)

BGA (Ball Grid Array)

QFP (Quad Flat Package)

SOP (Small Outline Package)

SSOP (Shrink Small Outline Package)

PLCC (Plastic Leaded Chip Carrier)

With our comprehensive open cavity package assembly services, we offer a reliable and efficient solution for semiconductor manufacturing. By leveraging our expertise in wafer prep and package assembly, we ensure that your ICs are encapsulated within high-quality open cavity packages, providing optimal performance, protection, and thermal dissipation. Partner with us to benefit from our state-of-the-art facility, skilled technicians, and a diverse range of package types. Experience the reliability and durability of our open cavity package assembly services for your semiconductor needs.


We will get back to you in 2-4 working days through email with the qoutation enquiry. For urgent enquiries, do contact us directly.