Flip Chip Bonding

flip chip bonding

 

As the trend of consumer products is driven towards the requirement of smaller, lighter and thinner devices, INTECH offers a smaller package type solution, flip chip, just for that market.

Flip chip is an integrated circuit fabrication packaging that provides smaller than traditional carrier based systems with less inductance, higher signal speed and better heat conducting, hence making it suitable for certain applications such as portable electronics.

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We will get back to you in 2-4 working days through email with the qoutation enquiry. For urgent enquiries, do contact us directly.