INTECH TECHNOLOGIES INTERNATIONAL
Established in 2008, Intech Technologies International Pte Ltd is a Singapore-based SME startup. Over the years, we have grown consistently and made a mark as a reliable provider of prototype builds, IC assembly solutions, and various services in the semiconductor industry.
Our strong customer base consists of leading semiconductor manufacturers from around the world. We specialize in high-value R&D prototype assembly services and assist customers in transitioning from the R&D stage to mass production.
At Intech Technologies International, we offer wafer preparation services such as wafer back grinding, dicing, die sorting, and laser marking. This suite of services caters to specific semiconductor manufacturing requirements.
Our packaging offerings include die attach and wire bonding techniques using aluminum and gold. We acknowledge the unique packaging needs of the semiconductor industry and provide tailored solutions accordingly.
We also provide comprehensive semiconductor failure analysis services. Our techniques for this include curve tracing, X-Ray analysis, hotspot analysis, Confocal Scanning Acoustic Microscopy (CSAM), scanning electron microscopy (SEM), and wire pull and ball shearing services. These capabilities help us identify and resolve issues effectively, ensuring the highest level of product reliability and quality.
Our commitment at Intech Technologies International is to deliver exceptional services, promote innovation, and build lasting partnerships with our clients. Our experienced team is dedicated to exceeding customer expectations, making us a trusted partner in the semiconductor industry
We take pride in our accomplishments: successfully executing more than 200 device production runs, managing over 1,000 unique assembly jobs, and satisfying the needs of over 1,200 customers.