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With our state-of-the-art dicing equipment, Intech offers wafer dicing services that cover half cut and full cut. Understanding your needs, we offer a fast turnaround time to get your product ready for the final assembly. The fully automated wafer dicing process that we employ is able to constantly meet individual business needs and tight industry requirements. INTECH dicing provides the capability to dice MEMS wafers, ceramic, glass and bismaleimide-triazine substrate panels.


We will get back to you in 2-4 working days through email with the qoutation enquiry. For urgent enquiries, do contact us directly.