Wafer Dicing Services

Intech Technologies International offers premier Wafer Dicing services, utilizing advanced techniques for semiconductor wafers.
wafer dicing

Intech specializes in providing advanced wafer dicing services to meet the diverse needs of the semiconductor industry. Our state-of-the-art facilities and cutting-edge technologies allow us to deliver precise and efficient dicing solutions for various types of wafers.

Wafer Dicing Services We Offer

  • Silicon Wafer Dicing

At Intech, we excel in dicing silicon wafers, a fundamental component in semiconductor manufacturing. Our expertise and precision equipment enable us to achieve accurate and clean cuts, ensuring the integrity and quality of the diced dies.

  • Cu Pillar Bump Wafer Dicing

We also offer dicing services for Cu pillar bump wafers, which are commonly used in advanced packaging applications. Our specialized equipment and techniques enable us to handle the unique requirements of Cu pillar bump wafers, providing precise and reliable dicing results.

  • Multiple Pattern Wafer (MPW) Dicing

Intech is experienced in dicing MPW wafers, which consist of multiple device patterns on a single wafer. With our advanced dicing methodologies, we can accurately separate the different patterns, ensuring optimal functionality and performance of each diced die.

  • MEMS Wafer Dicing

MEMS (Microelectromechanical Systems) wafers require specialized dicing techniques due to their delicate nature. Our skilled technicians and advanced equipment ensure the precise dicing of MEMS wafers, maintaining the integrity of the microstructures and achieving high-quality results.

  • Glass Dicing

Intech offers glass dicing services for various types of glass substrates used in semiconductor and optical applications. Examples include borosilicate glass and Schott D261. Our advanced equipment and expertise in handling delicate materials allow us to achieve precise and clean cuts on glass wafers, meeting the stringent requirements of these specialized applications.

Die Sorting Services We Offer

In addition to our comprehensive wafer dicing capabilities, Intech also provides professional die sorting services to ensure the quality and efficiency of your semiconductor manufacturing process. Our die sorting processes involve meticulous inspection and classification of diced dies to meet the specific requirements of each project.

  • Waffle Pack Sorting 

Our die sorting experts utilize advanced equipment to accurately place the diced dies into waffle pack trays. This systematic approach ensures proper organization and protection of the dies, facilitating ease of handling and further assembly processes.

  • Gel Pack Sorting

Intech offers reliable gel pack sorting services, where the diced dies are encapsulated in gel-filled packages. This packaging method provides enhanced protection and stability, particularly for sensitive or fragile components, ensuring the integrity of the dies during subsequent handling and assembly.

With our die sorting capabilities, you can have confidence in the quality and reliability of your diced dies. Our skilled technicians, state-of-the-art equipment, and stringent quality control processes ensure that each die meets the required specifications and is ready for the next stage of the manufacturing process.

Partner with Intech for comprehensive wafer dicing and die sorting services. Our expertise, advanced technologies, and commitment to excellence enable us to deliver precise, efficient, and high-quality results for your semiconductor manufacturing needs. Trust us to handle your wafer dicing and die sorting requirements with professionalism and precision, contributing to the success of your semiconductor projects.


We will get back to you in 2-4 working days through email with the qoutation enquiry. For urgent enquiries, do contact us directly.