Wafer Preparation

Intech Technologies International leads the way in wafer preparation, employing cutting-edge techniques to achieve superior semiconductor packaging, guaranteeing exceptional quality for our clients.
Waffer backgrinding service by intech

Wafer Backgrinding & Wafer thinning

Intech offers top-notch wafer thinning services to meet your specific requirements. With our advanced capabilities and expertise, we can precisely reduce the thickness of your wafers while maintaining excellent flatness and surface quality. Our state-of-the-art equipment and cutting-edge techniques ensure precise control over the thinning process, resulting in optimal device performance and reliability. Whether you need wafer thinning for silicon, compound semiconductors, or specialty substrates, we have the expertise to deliver outstanding results. Our team of skilled professionals follows stringent quality standards to ensure the highest level of precision and consistency. Partner with Intech for superior wafer thinning services that meet the demands of today’s semiconductor industry.

Laser Grooving

Intech specializes in providing high-quality laser grooving services for a wide range of applications. Our advanced laser grooving technology allows for precise and efficient cuts in wafers, ensuring superior results with minimal thermal damage. With our expertise in low-K grooving, we can effectively remove the wiring layer, including the low-K film, without compromising the wafer’s integrity. Our laser grooving processes, including Pi Laser Grooving and Omega Laser Grooving, offer flexibility and efficiency, resulting in excellent cut quality. Our team of experts utilizes state-of-the-art equipment and techniques to deliver reliable and precise laser grooving solutions. Trust Intech for your laser grooving needs, and experience enhanced performance and quality for your semiconductor devices.

laser grooving
wafer dicing

Wafer Dicing

Intech offers comprehensive wafer dicing services to meet the diverse needs of the semiconductor industry. With advanced dicing technology and expertise, we provide precise and efficient dicing solutions for various types of wafers, including bare silicon, Cu pillar bump, multiple pattern, MEMS, and glass wafers. Our skilled technicians utilize advanced techniques to minimize the risk of chipping, delamination, and other cut-quality issues, ensuring high-quality diced wafers ready for further processing. Trust Intech for reliable and efficient wafer dicing services that contribute to the success of your semiconductor manufacturing process.

Die Sorting

Our die sorting services are designed to meet the specific requirements of the semiconductor industry. With advanced equipment and a skilled team, we provide accurate and efficient sorting of semiconductor dies to ensure high-quality results. Whether you need wafer-level testing, packaging, or quality control, our comprehensive die sorting solutions have got you covered. We can handle a wide range of die sizes and configurations, offering precise and consistent sorting according to your specifications. At Intech, we prioritize excellence and attention to detail to ensure that each die is carefully sorted and meets the necessary standards. Enhance the efficiency and reliability of your semiconductor manufacturing process with our reliable die sorting services.

Die Sorting