Package Assembly

Intech Technologies International leads the industry in package assembly, providing precise and efficient solutions for semiconductor packaging.
picture of die attach

Die Attach

Our die attach process is a critical step in semiconductor assembly, ensuring the secure and precise bonding of the semiconductor die to its package. At Intech, we specialize in providing high-quality die attach services that meet the stringent requirements of the industry. Using advanced equipment and proven techniques, we ensure optimal die placement and alignment for maximum performance and reliability. Our experienced team works closely with you to understand your specific die attach needs and develop customized solutions. Whether you require epoxy die attach, solder die attach, or other specialized techniques, we have the expertise to deliver exceptional results. With a focus on precision, consistency, and quality, our die attach process ensures the integrity and functionality of your semiconductor devices. Trust Intech for reliable and efficient die attach services that meet the highest industry standards.

Wire Bonding

At Intech, we offer comprehensive wire bonding services that cater to various semiconductor packaging needs. With expertise in both wedge bonding and ball bonding techniques using gold (Au) wire, we provide reliable and high-quality wire bonding solutions. Our skilled technicians ensure precise wire placement, bonding, and interconnection, resulting in robust and efficient semiconductor devices. Whether you require wedge bonding for its superior power and high-frequency capabilities or ball bonding for its versatility and cost-effectiveness, we have the capabilities to meet your specific requirements. With state-of-the-art equipment and a commitment to excellence, we deliver exceptional wire bonding results with excellent bond strength and electrical conductivity. Trust Intech for your wire bonding needs, and let us help you achieve optimal performance and reliability in your semiconductor devices.

wire bonding service
Encapsulation

Encapsulation

Intech offers comprehensive wafer dicing services to meet the diverse needs of the semiconductor industry. With advanced dicing technology and expertise, we provide precise and efficient dicing solutions for various types of wafers, including bare silicon, Cu pillar bump, multiple pattern, MEMS, and glass wafers. Our skilled technicians utilize advanced techniques to minimize the risk of chipping, delamination, and other cut-quality issues, ensuring high-quality diced wafers ready for further processing. Trust Intech for reliable and efficient wafer dicing services that contribute to the success of your semiconductor manufacturing process.

Package Sealing with Lid

Intech specializes in package sealing using both ceramic and plastic lids to ensure the secure and reliable packaging of semiconductor devices. Our package sealing process involves the careful placement and bonding of lids to protect the sensitive components within the package. Whether using ceramic lids for high-temperature applications or plastic lids for cost-effective solutions, we ensure a tight and hermetic seal that prevents moisture and contaminants from entering the package. Our expertise in lid sealing allows us to meet the stringent requirements for various industries, including automotive, aerospace, and consumer electronics. With our state-of-the-art equipment and stringent quality control measures, we deliver package sealing solutions that provide excellent protection and reliability for your semiconductor devices. Trust Intech for professional package sealing services that meet the highest industry standards and ensure the integrity of your electronic components.

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