We Are Intech Technologies International
Intech Technologies International, based in Singapore since 2008, boasts over 15 years of experience in providing innovative prototype build, IC packaging services and assembly solutions, and semiconductor services. Our expertise in wafer preparation includes back grinding, dicing, and die sorting. Additionally, we offer die attach and wire bonding services using aluminum and gold. Our capabilities extend to reliable semiconductor failure analysis, further bolstering product reliability and quality. Having successfully executed over 200 device production runs and over 1,000 unique assembly jobs, we’ve catered to a diverse customer base, including over 1,200 satisfied customers, with a significant focus on serving universities and research institutes globally.
WHAT WE DO
INTECH takes up the challenges of making the best and precise results in meeting every customer’s goal with innovative and integrated solutions for variety of industry applications.
We provide a wide range of post fabrication and packaging services for semiconductor and electronics manufacturers
Transit your product from wafer to usable die with faster lead time
Enable you to stay competitive in market with reduced time-to-market.
Our services span from IC packaging services, wafer backgrinding or thinning, through to wafer dicing and die sorting, setting the stage for meticulous die attachment. We ensure each die is securely bonded to the package, establishing optimal electrical connections. Wire bonding, a crucial step that creates robust electrical connections between the die and the package leads, is carried out using advanced techniques. We then complete the IC packaging process with package sealing, meticulously assembling the lid to the package to provide robust environmental protection.
Unique assembly jobs
Device production runs
Unique assembly jobs
OPEN CAVITY/ AIR CAVITY PACKAGES
At Intech Technologies, we are dedicated to providing expert assembly services for a range of package types, focusing on air cavity and plastic molded packages, designed to cater to different production scales and budget considerations.
Our air cavity package assembly services are ideal for projects requiring lower volumes. We work with precision to assemble these packages using ceramic and plastic materials, ensuring optimal thermal dissipation, electrical insulation, and mechanical strength. This method is particularly cost-effective for smaller quantity unit assembly, offering superior protection and performance for integrated circuits (ICs).
For larger-scale, high-volume production needs, we offer assembly services for plastic molded packages. Although the initial tooling cost can be higher, the efficiency and economies of scale realized in mass production make it a financially viable option over time. The process involves a series of stages, including lead frame design, die attachment, wire bonding, molding, and marking, each executed with the utmost attention to detail.
At Intech Technologies, we uphold stringent quality control standards and precision in all our assembly processes. Our experienced team is committed to delivering custom solutions that align with your specific semiconductor requirements. Whether it’s the assembly of air cavity packages or plastic molded packages, we assure reliable, high-quality results for your semiconductor needs.