Contact Number:

(+65) 62881246

Email:

sales@intech-technologies.com

Address

20 Woodland Links #07-07 SG(738733)

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      • WAFER DICING
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      • Wire Bonding
      • Flip Chip Bonding
      • SEM
      • X-Ray
      • Die Shear | Wire Pull
    • Packaging Services
      • Packaging Molding (Encapsulation)
      • Low Profile Quad Flat Package (LQFP)
      • Quad Flat No Lead Package (QFNL)
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Menu
  • Home
  • About Us
  • Services
    • Dicing Services
      • WAFER DICING
      • Die Sort
    • Assembly Services
      • WAFER BACKGRINDING | WAFER THINNING
      • Die Bond
      • Wire Bonding
      • Flip Chip Bonding
      • SEM
      • X-Ray
      • Die Shear | Wire Pull
    • Packaging Services
      • Packaging Molding (Encapsulation)
      • Low Profile Quad Flat Package (LQFP)
      • Quad Flat No Lead Package (QFNL)
  • Contact Us
  • Shop
  • Home
  • About Us
  • Services
    • Dicing Services
      • WAFER DICING
      • Die Sort
    • Assembly Services
      • WAFER BACKGRINDING | WAFER THINNING
      • Die Bond
      • Wire Bonding
      • Flip Chip Bonding
      • SEM
      • X-Ray
      • Die Shear | Wire Pull
    • Packaging Services
      • Packaging Molding (Encapsulation)
      • Low Profile Quad Flat Package (LQFP)
      • Quad Flat No Lead Package (QFNL)

    DICING SERVICES

    WAFER DICING

    DIE SORT

    PACKAGING SERVICES

    PACKAGE MOLDING ENCAPSULATION

    LOW PROFILE QUAD FLAT PACKAGE (LQFP)

    QUAD FLAT NO LEAD PACKAGE (QFNL)

    ASSEMBLY SERVICES

    WAFER BACKGRINDING | WAFER THINNING

    DIE BOND

    WIRE BONDING

    FLIP CHIP BONDING

    SEM

    X-RAY

    DIE SHEAR | WIRE PULL

  • Contact Us
  • Shop
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INTECH TECHNOLOGIES INTERNATIONAL

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Menu
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  • Contact Us
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Contact Number:

(+65) 62881246

EMAIL:

sales@intech-technologies.com

ADDRESS:

20 Woodland Links #07-07 SG(738733)

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