• To complement our wafer dicing, INTECH also offers automated die sorting services. Our die sorting systems work on import wafer maps or ink dot recognition.

• Our trained personnel along with manual die sorting systems are available so die sort projects that do not lend themselves to automation are not a problem. 

• Die sort is packaged to chip tray or Gel Pak® or as per customer requirements.

• Whether you require high volume production or a single wafer prototype build, INTECH has the die sorting solution for you

With our state-of-the-art dicing equipment, Intech offers wafer dicing services that cover half cut and full cut. Understanding your needs, we offer a fast turnaround time to get your product ready for the final assembly. The fully automated wafer dicing process that we employ is able to constantly meet individual business needs and tight industry requirements. INTECH dicing provides the capability to dice MEMS wafers, ceramic, glass and bismaleimide-triazine substrate panels.