Intech offers an advanced low-K grooving solution that enables high-quality cuts with laser grooving technology. Our capabilities in low-K grooving allow us to provide precise and efficient processing of low-k films, ensuring excellent results without the risk of film peeling or damage. With our state-of-the-art laser grooving equipment and expertise, we deliver superior performance and reliability for your semiconductor manufacturing needs.
Mechanical Strength of Low-K Film
The low-K film used as an insulating layer in high-speed logic applications often has low mechanical strength, making it susceptible to film peeling during the traditional blade dicing process. Our low-K grooving solution effectively removes the wiring layer, including the low-K film, using advanced laser grooving equipment. This process ensures the integrity of the low-K film while achieving accurate cuts and preventing any damage or peeling.
Intech Technologies’ Laser Grooving Process
Our DFL7161 fully-automatic laser saw is specifically designed for low-K grooving applications. This equipment utilizes a pulse laser for non-thermal processing, ensuring precise and controlled grooving of low-K films. Whether you require “Pi Laser Grooving” or “Omega Laser Grooving,” our laser grooving solution delivers excellent throughput while minimizing chipping, delamination, and other cut-quality issues. The laser grooving process is performed rapidly and seamlessly, allowing for efficient production and consistent results.
Excellent Precision and Ease of Use
The DFL7161 laser saw is equipped with cutting-edge technology to ensure precision and ease of operation. The short pulse laser used in our grooving solution achieves high-quality processing with minimal distortion and deformation due to heating. The equipment features an LCD touch screen graphical user interface, enabling intuitive control and efficient operation. Our solution provides the reliability and performance you need for low-K grooving applications, ensuring consistent and accurate cuts every time.
Why Choose Intech Technologies for Low-K Laser Grooving Solution
Superior Performance
Our laser grooving technology ensures precise and clean cuts in low-K films, maintaining the integrity of the materials and enhancing overall performance.
Increased Efficiency
With our efficient laser grooving process, you can achieve higher throughput and minimize production time, optimizing your semiconductor manufacturing operations.
Enhanced Product Quality
The accurate and controlled grooving provided by our solution minimizes the risk of film peeling or damage, resulting in high-quality semiconductor components and improved product reliability.
Partner with Intech for your low-K grooving needs, and experience the advantages of our advanced laser grooving solution. Our expertise, state-of-the-art equipment, and commitment to excellence ensure that we deliver superior results, meeting the stringent requirements of your semiconductor manufacturing projects. Trust us to provide precise, efficient, and high-quality low-K grooving services tailored to your specific needs.
