QFNL Packages

INTECH offers standard backgrinding and bumped wafer backgrinding. We use automated state-of-the-art wafer backgrinding equipment to achieve the highest level of quality available and can continuously achieve thin wafer target thicknesses up to 0.05 mm for 8” and 12” wafers. We provide bumped wafer backgrinding, standard wafer grinding, single die backgrinding, and custom wafer backgrinding all with streamlined processing time.

GET A QUOTATION

We will get back to you in 2-4 working days through email with the qoutation enquiry. For urgent enquiries, do contact us directly.