INTECH offers standard backgrinding and bumped wafer backgrinding. We use automated state-of-the-art wafer backgrinding equipment to achieve the highest level of quality available and can continuously achieve thin wafer target thicknesses up to 0.05 mm for 8” and 12” wafers. We provide bumped wafer backgrinding, standard wafer grinding, single die backgrinding, and custom wafer backgrinding all with streamlined processing time.

INTECH offers standard backgrinding and bumped wafer backgrinding. We use automated state-of-the-art wafer backgrinding equipment to achieve the highest level of quality available and can continuously achieve thin wafer target thicknesses up to 0.05 mm for 8” and 12” wafers. We provide bumped wafer backgrinding, standard wafer grinding, single die backgrinding, and custom wafer backgrinding all with streamlined processing time.

• To complement our wafer dicing, INTECH also offers automated die sorting services. Our die sorting systems work on import wafer maps or ink dot recognition.

• Our trained personnel along with manual die sorting systems are available so die sort projects that do not lend themselves to automation are not a problem. 

• Die sort is packaged to chip tray or Gel Pak® or as per customer requirements.

• Whether you require high volume production or a single wafer prototype build, INTECH has the die sorting solution for you