What is the best IC packaging for PCB?

We all know that optimal performance and reliability of printed circuit boards (PCBs) all comes down to IC packaging.

As experts in IC packaging solution providers, let us help you to choose the best suited IC packaging for your PCB from the wide range of packaging options available, including dual in-line package (DIP), quad flat package (QFP), ball grid array (BGA), and more.

You can thank us later for saving you from a daunting task.

Dual In-Line Package (DIP)

DIP is the oldest and most traditional IC packaging option and they have become quite popular due to their simplicity and cost-effectiveness. DIP packages are ideal for low to medium-density designs and are widely used in various applications due to its distinguishing feature of two rows of pins or leads extending from the sides, allowing for easy insertion into PCBs.

Quad Flat Package (QFP)

QFP is a surface-mount IC packaging option known for its compact size and high-pin count capabilities. It features four sides with leads on each side, allowing for increased pin density and better thermal performance. QFP packages are commonly used in consumer electronics, telecommunications, and automotive industries.

Ball Grid Array (BGA)

BGA is a popular IC packaging option that offers superior electrical and thermal performance. Instead of traditional leads, BGA packages utilize solder balls arranged in a grid pattern on the underside of the IC. This arrangement provides better electrical conductivity, increased pin count, and improved resistance to mechanical stress. BGA packages are widely used in high-density applications, such as microprocessors, GPUs, and memory modules.

Small Outline Integrated Circuit (SOIC)

SOIC is a widely used surface-mount IC packaging option known for its compact size and compatibility with automated manufacturing processes. It features gull-wing leads on two sides, providing excellent electrical performance and efficient heat dissipation. SOIC packages are commonly used in a wide range of applications, including consumer electronics, industrial equipment, and telecommunications.

Chip Scale Package (CSP)

CSP is an advanced IC packaging option that offers a significant reduction in size while maintaining excellent electrical performance. CSP packages have a footprint size similar to the actual IC die, eliminating the need for extra space for packaging. CSP offers high pin counts, low power consumption, and enhanced thermal characteristics, making it ideal for miniaturized devices such as smartphones, wearables, and IoT applications.

When we choose the best IC packaging for your PCB, we carefully consider key factors such as pin count, space constraints, thermal performance, and electrical requirements to ensure the optimal choice that balances performance, reliability, and cost-effectiveness for your PCB.

While we work with common options such as DIP, QFP, BGA, SOIC, and CSP packages we continue to embrace newer packaging technologies that continue to emerge to meet the evolving needs of the electronics industry.

What are the processes involved in wafer fabrication?

The world of semiconductors would not exist without the process that keeps these micro components together! Therefore Wafer fabrication has become a process that is known to all.

Let’s take a look at the general steps of Wafer fabrication that would make you an expert in the industry!

  1. Crystal Growth: Wafer fabrication begins with growing a single crystal ingot of semiconductor material, commonly silicon. This is achieved through a process called the Czochralski method, where a seed crystal is dipped into molten silicon and slowly rotated to pull a larger, single crystal out of the melt. The ingot is then sliced into thin circular discs known as silicon wafers.
  2. Wafer Cleaning: Once the wafers are sliced, they undergo a thorough cleaning process to remove any impurities or contaminants. This typically involves using cleaning solutions, deionized water, and mechanical scrubbing methods to achieve a high level of cleanliness.
  3. Oxidation: Next, the silicon wafers are subjected to an oxidation process. This involves exposing the wafers to high temperatures in the presence of oxygen or steam, forming a thin layer of silicon dioxide (SiO2) on their surface. This oxide layer serves as an insulator and protects the underlying silicon during subsequent fabrication steps.
  4. Photolithography: The process of photolithography is crucial for creating intricate patterns on the wafer’s surface. A light-sensitive material, called a photoresist, is applied to the wafer, and a mask is carefully aligned and placed over it. UV light is then applied, transferring the pattern from the mask to the photoresist. This pattern delineates the areas where subsequent processes will take place.
  5. Etching: Etching is used to remove material selectively from the wafer’s surface according to the pattern defined during the photolithography step. There are two main types of etching techniques: wet etching, which involves dipping the wafer into a chemical solution, and dry etching, which utilizes plasma to remove material. These processes are vital for creating features such as transistors, interconnects, and contact points.
  6. Deposition: Deposition involves adding layers of various materials, such as metals or insulators, onto the wafer’s surface. There are different methods of deposition, including chemical vapor deposition (CVD), physical vapor deposition (PVD), and atomic layer deposition (ALD). These techniques allow for the precise formation of thin films to enhance conductivity, insulation, and other necessary properties.
  7. Doping: To modify the electrical properties of specific regions on the wafer, dopants (impurities) are introduced. This process, known as doping, involves diffusing specific atoms, such as boron or phosphorus, into the silicon lattice. Doping is essential for creating various types of transistors, diodes, and other semiconductor devices on the wafer.
  8. Annealing: After deposition and doping, the wafers go through an annealing process. Annealing involves subjecting the wafers to high temperatures to activate the dopants and fully recover any crystal damage caused during the previous steps. This helps stabilize the wafer’s electrical properties and ensures reliable performance of semiconductor devices.

Yes! You guessed right! Wafer fabrication is a complex and meticulously controlled process, involving multiple steps that transform a simple silicon wafer into a sophisticated electronic component. Through understanding these processes contribute effectively to the development of advanced electronic devices we rely on today!

What Is IC Packaging & Why Is It Important?

Need we explain what happens if the circuit design is not secured properly? Yes, you waste your entire effort and also the hassle to redo. Not to mention how your clients are not going to be happy either!

Therefore, let’s look at one of the most important processes in the world of electronics!

Semiconductor packaging or IC packaging!

What is IC Packaging?

IC packaging, or integrated circuit packaging, refers to the process of protecting and enclosing integrated circuits within a protective covering. It involves assembling and enclosing electronic components, such as the silicon chips, into packages that provide electrical connectivity and mechanical support. 

IC packaging is the crucial step that transforms the fragile ICs into sturdy, reliable, and easily usable devices.

Why is IC Packaging Important?

Protection and Reliability

Ofcourse! The most obvious importance of IC packaging is  protection against physical damage, moisture, dust, and other environmental factors that could potentially harm the delicate ICs. Furthermore, it enhances the longevity and performance of the electronic devices, making them more reliable in diverse operating conditions.

Seamless Electrical connectivity

IC packaging incorporates the connections of various contact pins, leads, or terminals that establish electrical connections between the IC chip and other components, such as circuit boards or connectors. These connections enable efficient flow of electrical signals, power, and data, ensuring seamless communication within electronic systems.

Miniaturization and Size Reduction

IC packaging massively contributes to miniaturization in the electronics industry. This compactness enables the creators to meet the demands of the modern day customer ; making the electronic devices smaller, sleeker, and easily portable. 

Effective Thermal Management

The IC packaging solutions help manage the heat generated during normal operations, dissipating it efficiently to prevent damage and maintain optimal performance. Therefore, thermal management effectively will help you to extend the lifespan of ICs and reduce the risk of failure due to overheating.

High-Speed Performance

IC packaging plays a crucial role in maximizing the electrical performance of integrated circuits. Carefully designed packages minimize signal degradation, power losses, and electromagnetic interference (EMI), enabling high-speed communication and reducing latency in electronic systems. This is especially critical in applications like telecommunications, automotive, and high-performance computing.

Product Differentiation and Customization

Different package types and styles offer companies the flexibility to tailor their products according to specific requirements, target markets, and applications. By partnering with the ideal IC packing solution provider, manufacturers can enhance their product’s functionality, reliability, and overall appeal to consumers.

It is inevitable that IC packaging helps in addressing a lot of critical challenges faced by the electronic manufacturers today. However, choosing a CREDIBLE IC PACKAGE SOLUTION PROVIDER is the ONLY way to make informed decisions to create superior, efficient, and innovative electronic devices, driving progress in the field of technology.

Contact us today to further explore what our IC packaging solutions could expand the horizon of your business.

Reliability Services

Ball Shear Reliability Services – Assessing Package Integrity (JESD22-B116 | JESD22-B117)

Intech Technologies leads the field in Ball Shear Reliability Services, utilizing the respected JEDEC (JESD22-B117) standards to ensure rigorous and consistent testing. The ball shear testing process plays an essential role in scrutinizing the mechanical resilience and integrity of solder joints within semiconductor packages.

Our state-of-the-art testing tools, coupled with our seasoned technicians, guarantee accurate and dependable outcomes, enabling clients to pinpoint potential failure sources and fortify their products. Through the replication of real-world stress scenarios, we facilitate enhancements to package design and manufacturing methodologies, culminating in elevated product performance and dependability.

At Intech Technologies, our Ball Shear Reliability Services are crafted to surpass client anticipations. We recognize the paramount importance of package solidity and dependability in the semiconductor industry, and our all-encompassing suite of services, including IC package assembly and failure analysis, ensures superior product quality and client satisfaction.

Boasting a history of delivering exceptional results, Intech Technologies emerges as a reliable ally in the pursuit of excellence in semiconductor production. Our dedication to distinction, adherence to JEDEC standards, and wide-ranging service offerings position us as the go-to choice for companies looking to propel their semiconductor products to greater heights of reliability and market success.

Wire Pull Testing: 

At Intech Technologies, our dedication to advancing the standards of reliability testing is embodied in our extensive Wire Pull services. Equipped with cutting-edge testing technology and a team of adept technicians, we execute in-depth analysis of bond strength and wire connections integrity within semiconductor packages.

The critical process of Wire Pull testing allows us to gauge the resilience and quality of the connections between wire bonds and bond pads. By applying controlled force to the wires, we expose potential frailties or susceptibility that may become apparent during the product’s lifespan. Our thorough and dependable testing methods equip our clients with meaningful data to refine their design and manufacturing protocols, thus maximizing performance and guaranteeing ultimate customer satisfaction.

Our Wire Pull Reliability Services are instrumental in the creation of superior semiconductor products. As your reliable ally, we do more than just present test results; we supply actionable data and insights that enable you to make knowledgeable decisions and fulfill the highest quality benchmarks. By amalgamating our extensive knowledge in IC package assembly and failure analysis, Intech Technologies presents a well-rounded array of services that promise unparalleled product reliability and carve a path for your market success.

Plastic Packages

Plastic package manufacturing for mass volume production is a widely utilized method in the semiconductor industry. By employing lead frames and plastic molding techniques, a variety of package types, including QFN (Quad Flat No-Lead), SOIC (Small Outline Integrated Circuit), QFP (Quad Flat Package), TQFP (Thin Quad Flat Package), PDIP (Plastic Dual In-Line Package), PLCC (Plastic Leaded Chip Carrier), and TSOP (Thin Small Outline Package), can be efficiently manufactured. This introduction provides an overview of the manufacturing process, highlighting the use of lead frames and plastic molding to meet the high-volume production requirements of the industry.



Tooling is a fundamental aspect of plastic package manufacturing. It involves designing and producing the necessary tools and equipment for various stages of the process. This includes:

Lead Frame Design and Production Tooling: Tools used to create the lead frames based on the design specifications, such as stamping dies, etching plates, or photoresist masks.

Mold Tool Design and Production: Tools required for molding the plastic encapsulant, including the mold cavities and associated features specific to each package type.

Molding Equipment: Specialized equipment used during the molding process, such as transfer molding machines that apply heat and pressure to inject the plastic encapsulant into the mold cavities.

II. Lead Frame Design and Production:

Lead frame design is a critical initial step in the manufacturing process. It involves creating precise designs for the metal structures that provide structural support and electrical pathways for the semiconductor devices. The lead frame production process employs techniques such as stamping, etching, or photo-etching to manufacture the lead frames according to the design specifications.

III. Die Attach:

Die attach is a crucial process where the semiconductor die is securely bonded to the lead frame. The die attach step ensures proper alignment and electrical connection between the die and the lead frame. Various techniques and materials, such as adhesive materials or soldering, may be employed depending on the specific requirements of the package.

IV. Wire Bonding:

Wire bonding establishes electrical connections between the die and the lead frame. It enables signal transmission from the die to the external circuits. Wire bonding techniques, such as ball-wedge or wedge-wedge bonding, are utilized to create reliable electrical connections using fine wires made of materials like gold or copper.

V. Molding:

The molding process encapsulates the lead frame, die, and wire bonds with a protective plastic compound. This step ensures the physical and environmental protection of the semiconductor device. The plastic encapsulant is injected under pressure into a mold cavity created by the mold tool, which is then solidified, forming the final package.

VI. Marking:

Marking plays a crucial role in identifying and providing essential information about the package. This step involves laser or inkjet printing of part numbers, logos, date codes, and other relevant information on the package. The marking helps with identification and traceability of the manufactured packages.

VII. Trim and Form (for select package types):

For certain package types, such as those requiring lead customization, a trim and form process is employed. This step involves cutting the leads to their final length and shaping them into their desired configuration. Trim and form ensures compatibility with surface-mount technology (SMT) and facilitates the efficient assembly of the packages onto printed circuit boards.

By ensuring proper tooling and following these essential process steps, semiconductor manufacturers can efficiently produce a variety of plastic packages for mass volume production, meeting the demands of the industry while maintaining high quality and reliability.

Open Cavity/ Air cavity Packages

We specialize in the assembly of open cavity packages, ensuring the encapsulation of integrated circuits (ICs) for optimal performance and protection. Our expertise extends beyond package assembly to include lid assembly, providing a complete solution for encapsulation needs.

Working with ceramic and plastic materials, we carefully construct open cavity packages that offer excellent thermal dissipation, electrical insulation, and mechanical strength. Whether it’s managing heat efficiently with ceramic packages or cost-effective solutions with plastic packages, we tailor our approach to meet specific requirements.

Additionally, we excel in lid assembly, a critical step in encapsulation. Our skilled technicians meticulously align and securely attach the lid to the package, ensuring the protection and integrity of the delicate die and wire connections. With precise adhesives or soldering techniques, we create a robust seal against environmental factors and contaminants.

Our open cavity package assembly, combined with meticulous lid assembly, delivers a comprehensive solution for encapsulating ICs. Whether you require encapsulation for low volume jobs or larger projects, our focus on quality and attention to detail ensures reliable and high-quality results.

Package Assembly Process:

Our package assembly process includes essential steps to ensure the successful encapsulation of integrated circuits (ICs) within open cavity packages. Here is an overview of the key stages involved:

Die Attach:

During this crucial step, the IC die is precisely attached to the open cavity package. Utilizing advanced techniques and equipment, we ensure accurate alignment and secure bonding between the die and the package. This step establishes reliable electrical connections and sets the foundation for optimal IC performance.

Wire Bonding:

Next, we establish essential electrical connections between the die and the package leads. Our experienced technicians employ advanced wire bonding techniques, such as wedge bonding or wire bonding, to establish secure and robust electrical connections. This ensures efficient signal transmission and functionality of the IC.

Encapsulation (Lid Assembly):

The encapsulation stage involves sealing the open cavity package to protect the delicate die and wire connections from external contaminants and environmental factors. The lid assembly process is carried out with meticulous care, aligning and securely attaching the lid to the package. Through precise adhesives or soldering techniques, we create a robust seal, ensuring the integrity and longevity of the encapsulated IC.


To enable easy identification and traceability, we incorporate a marking process that ensures clear and permanent identification on the package surface. Through advanced laser marking technology, we imprint relevant information such as part numbers, lot codes, and manufacturer logos onto the package. This meticulous marking process guarantees accurate identification and seamless integration into inventory management and quality control systems.

At every stage of the package assembly process, we prioritize quality control and utilize state-of-the-art equipment to ensure precision and reliability. Our skilled technicians possess extensive expertise in package assembly, enabling us to deliver high-quality encapsulation solutions tailored to meet the specific requirements of our customers.

Please note that our package assembly process may vary depending on the project requirements and package type. We are committed to adapting our processes to accommodate your unique needs and deliver exceptional results.

Open Cavity Package Types:

Our comprehensive package assembly services cover a broad range of open cavity package types. Alongside the well-known CSP (Chip Scale Package) and WLP (Wafer-Level Package), we specialize in assembling the following popular package types:

QFN (Quad Flat No-Lead)

DFN (Dual Flat No-Lead)

SON (Small Outline No-Lead)

MLP (Micro Leadframe Package)

LGA (Land Grid Array)

BGA (Ball Grid Array)

QFP (Quad Flat Package)

SOP (Small Outline Package)

SSOP (Shrink Small Outline Package)

PLCC (Plastic Leaded Chip Carrier)

With our comprehensive open cavity package assembly services, we offer a reliable and efficient solution for semiconductor manufacturing. By leveraging our expertise in wafer prep and package assembly, we ensure that your ICs are encapsulated within high-quality open cavity packages, providing optimal performance, protection, and thermal dissipation. Partner with us to benefit from our state-of-the-art facility, skilled technicians, and a diverse range of package types. Experience the reliability and durability of our open cavity package assembly services for your semiconductor needs.