Reliability Services

Ball Shear Reliability Services – Assessing Package Integrity (JESD22-B116 | JESD22-B117)

Intech Technologies leads the field in Ball Shear Reliability Services, utilizing the respected JEDEC (JESD22-B117) standards to ensure rigorous and consistent testing. The ball shear testing process plays an essential role in scrutinizing the mechanical resilience and integrity of solder joints within semiconductor packages.

Our state-of-the-art testing tools, coupled with our seasoned technicians, guarantee accurate and dependable outcomes, enabling clients to pinpoint potential failure sources and fortify their products. Through the replication of real-world stress scenarios, we facilitate enhancements to package design and manufacturing methodologies, culminating in elevated product performance and dependability.

At Intech Technologies, our Ball Shear Reliability Services are crafted to surpass client anticipations. We recognize the paramount importance of package solidity and dependability in the semiconductor industry, and our all-encompassing suite of services, including IC package assembly and failure analysis, ensures superior product quality and client satisfaction.

Boasting a history of delivering exceptional results, Intech Technologies emerges as a reliable ally in the pursuit of excellence in semiconductor production. Our dedication to distinction, adherence to JEDEC standards, and wide-ranging service offerings position us as the go-to choice for companies looking to propel their semiconductor products to greater heights of reliability and market success.

Wire Pull Testing: 

At Intech Technologies, our dedication to advancing the standards of reliability testing is embodied in our extensive Wire Pull services. Equipped with cutting-edge testing technology and a team of adept technicians, we execute in-depth analysis of bond strength and wire connections integrity within semiconductor packages.

The critical process of Wire Pull testing allows us to gauge the resilience and quality of the connections between wire bonds and bond pads. By applying controlled force to the wires, we expose potential frailties or susceptibility that may become apparent during the product’s lifespan. Our thorough and dependable testing methods equip our clients with meaningful data to refine their design and manufacturing protocols, thus maximizing performance and guaranteeing ultimate customer satisfaction.

Our Wire Pull Reliability Services are instrumental in the creation of superior semiconductor products. As your reliable ally, we do more than just present test results; we supply actionable data and insights that enable you to make knowledgeable decisions and fulfill the highest quality benchmarks. By amalgamating our extensive knowledge in IC package assembly and failure analysis, Intech Technologies presents a well-rounded array of services that promise unparalleled product reliability and carve a path for your market success.

Plastic Packages

Plastic package manufacturing for mass volume production is a widely utilized method in the semiconductor industry. By employing lead frames and plastic molding techniques, a variety of package types, including QFN (Quad Flat No-Lead), SOIC (Small Outline Integrated Circuit), QFP (Quad Flat Package), TQFP (Thin Quad Flat Package), PDIP (Plastic Dual In-Line Package), PLCC (Plastic Leaded Chip Carrier), and TSOP (Thin Small Outline Package), can be efficiently manufactured. This introduction provides an overview of the manufacturing process, highlighting the use of lead frames and plastic molding to meet the high-volume production requirements of the industry.



Tooling is a fundamental aspect of plastic package manufacturing. It involves designing and producing the necessary tools and equipment for various stages of the process. This includes: Lead Frame Design and Production Tooling: Tools used to create the lead frames based on the design specifications, such as stamping dies, etching plates, or photoresist masks. Mold Tool Design and Production: Tools required for molding the plastic encapsulant, including the mold cavities and associated features specific to each package type. Molding Equipment: Specialized equipment used during the molding process, such as transfer molding machines that apply heat and pressure to inject the plastic encapsulant into the mold cavities.

II. Lead Frame Design and Production:

Lead frame design is a critical initial step in the manufacturing process. It involves creating precise designs for the metal structures that provide structural support and electrical pathways for the semiconductor devices. The lead frame production process employs techniques such as stamping, etching, or photo-etching to manufacture the lead frames according to the design specifications.

III. Die Attach:

Die attach is a crucial process where the semiconductor die is securely bonded to the lead frame. The die attach step ensures proper alignment and electrical connection between the die and the lead frame. Various techniques and materials, such as adhesive materials or soldering, may be employed depending on the specific requirements of the package.

IV. Wire Bonding:

Wire bonding establishes electrical connections between the die and the lead frame. It enables signal transmission from the die to the external circuits. Wire bonding techniques, such as ball-wedge or wedge-wedge bonding, are utilized to create reliable electrical connections using fine wires made of materials like gold or copper.

V. Molding:

The molding process encapsulates the lead frame, die, and wire bonds with a protective plastic compound. This step ensures the physical and environmental protection of the semiconductor device. The plastic encapsulant is injected under pressure into a mold cavity created by the mold tool, which is then solidified, forming the final package.

VI. Marking:

Marking plays a crucial role in identifying and providing essential information about the package. This step involves laser or inkjet printing of part numbers, logos, date codes, and other relevant information on the package. The marking helps with identification and traceability of the manufactured packages.

VII. Trim and Form (for select package types):

For certain package types, such as those requiring lead customization, a trim and form process is employed. This step involves cutting the leads to their final length and shaping them into their desired configuration. Trim and form ensures compatibility with surface-mount technology (SMT) and facilitates the efficient assembly of the packages onto printed circuit boards. By ensuring proper tooling and following these essential process steps, semiconductor manufacturers can efficiently produce a variety of plastic packages for mass volume production, meeting the demands of the industry while maintaining high quality and reliability.

Open Cavity/ Air cavity Packages

We specialize in the assembly of open cavity packages, ensuring the encapsulation of integrated circuits (ICs) for optimal performance and protection. Our expertise extends beyond package assembly to include lid assembly, providing a complete solution for encapsulation needs.

Working with ceramic and plastic materials, we carefully construct open cavity packages that offer excellent thermal dissipation, electrical insulation, and mechanical strength. Whether it’s managing heat efficiently with ceramic packages or cost-effective solutions with plastic packages, we tailor our approach to meet specific requirements.

Additionally, we excel in lid assembly, a critical step in encapsulation. Our skilled technicians meticulously align and securely attach the lid to the package, ensuring the protection and integrity of the delicate die and wire connections. With precise adhesives or soldering techniques, we create a robust seal against environmental factors and contaminants.

Our open cavity package assembly, combined with meticulous lid assembly, delivers a comprehensive solution for encapsulating ICs. Whether you require encapsulation for low volume jobs or larger projects, our focus on quality and attention to detail ensures reliable and high-quality results.


Package Assembly Process:

Our package assembly process includes essential steps to ensure the successful encapsulation of integrated circuits (ICs) within open cavity packages. Here is an overview of the key stages involved:

Die Attach:

During this crucial step, the IC die is precisely attached to the open cavity package. Utilizing advanced techniques and equipment, we ensure accurate alignment and secure bonding between the die and the package. This step establishes reliable electrical connections and sets the foundation for optimal IC performance.

Wire Bonding:

Next, we establish essential electrical connections between the die and the package leads. Our experienced technicians employ advanced wire bonding techniques, such as wedge bonding or wire bonding, to establish secure and robust electrical connections. This ensures efficient signal transmission and functionality of the IC.

Encapsulation (Lid Assembly):

The encapsulation stage involves sealing the open cavity package to protect the delicate die and wire connections from external contaminants and environmental factors. The lid assembly process is carried out with meticulous care, aligning and securely attaching the lid to the package. Through precise adhesives or soldering techniques, we create a robust seal, ensuring the integrity and longevity of the encapsulated IC.



To enable easy identification and traceability, we incorporate a marking process that ensures clear and permanent identification on the package surface. Through advanced laser marking technology, we imprint relevant information such as part numbers, lot codes, and manufacturer logos onto the package. This meticulous marking process guarantees accurate identification and seamless integration into inventory management and quality control systems.

At every stage of the package assembly process, we prioritize quality control and utilize state-of-the-art equipment to ensure precision and reliability. Our skilled technicians possess extensive expertise in package assembly, enabling us to deliver high-quality encapsulation solutions tailored to meet the specific requirements of our customers.

Please note that our package assembly process may vary depending on the project requirements and package type. We are committed to adapting our processes to accommodate your unique needs and deliver exceptional results.


Open Cavity Package Types:

Our comprehensive package assembly services cover a broad range of open cavity package types. Alongside the well-known CSP (Chip Scale Package) and WLP (Wafer-Level Package), we specialize in assembling the following popular package types:

QFN (Quad Flat No-Lead)

DFN (Dual Flat No-Lead)

SON (Small Outline No-Lead)

MLP (Micro Leadframe Package)

LGA (Land Grid Array)

BGA (Ball Grid Array)

QFP (Quad Flat Package)

SOP (Small Outline Package)

SSOP (Shrink Small Outline Package)

PLCC (Plastic Leaded Chip Carrier)


With our comprehensive open cavity package assembly services, we offer a reliable and efficient solution for semiconductor manufacturing. By leveraging our expertise in wafer prep and package assembly, we ensure that your ICs are encapsulated within high-quality open cavity packages, providing optimal performance, protection, and thermal dissipation. Partner with us to benefit from our state-of-the-art facility, skilled technicians, and a diverse range of package types. Experience the reliability and durability of our open cavity package assembly services for your semiconductor needs.

Quad Flat No Lead Package (QFNL)

INTECH offers standard backgrinding and bumped wafer backgrinding. We use automated state-of-the-art wafer backgrinding equipment to achieve the highest level of quality available and can continuously achieve thin wafer target thicknesses up to 0.05 mm for 8” and 12” wafers. We provide bumped wafer backgrinding, standard wafer grinding, single die backgrinding, and custom wafer backgrinding all with streamlined processing time.

Low Profile Quad Flat Package (LQFP)

INTECH offers standard backgrinding and bumped wafer backgrinding. We use automated state-of-the-art wafer backgrinding equipment to achieve the highest level of quality available and can continuously achieve thin wafer target thicknesses up to 0.05 mm for 8” and 12” wafers. We provide bumped wafer backgrinding, standard wafer grinding, single die backgrinding, and custom wafer backgrinding all with streamlined processing time.

Packaging Molding (Encapsulation)

• To complement our wafer dicing, INTECH also offers automated die sorting services. Our die sorting systems work on import wafer maps or ink dot recognition.

• Our trained personnel along with manual die sorting systems are available so die sort projects that do not lend themselves to automation are not a problem. 

• Die sort is packaged to chip tray or Gel Pak® or as per customer requirements.

• Whether you require high volume production or a single wafer prototype build, INTECH has the die sorting solution for you