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Packaging Molding (Encapsulation)

• To complement our wafer dicing, INTECH also offers automated die sorting services. Our die sorting systems work on import wafer maps or ink dot recognition.

• Our trained personnel along with manual die sorting systems are available so die sort projects that do not lend themselves to automation are not a problem. 

• Die sort is packaged to chip tray or Gel Pak® or as per customer requirements.

• Whether you require high volume production or a single wafer prototype build, INTECH has the die sorting solution for you


We will get back to you in 2-4 working days through email with the qoutation enquiry. For urgent enquiries, do contact us directly.