failure analysis3-x-ray

To further enhance failure analysis where the product has been encapsulated, an X-ray system is available to provide high magnification, high contrast and highly detailed real-time images for failure analysis. The detailed X-ray image is capable of inspecting interconnection wires on IC as well as pin point defects such as solder joint shorts, opens and voids.


We will get back to you in 2-4 working days through email with the qoutation enquiry. For urgent enquiries, do contact us directly.