X-Ray

failure analysis3-x-ray

To further enhance failure analysis where the product has been encapsulated, an X-ray system is available to provide high magnification, high contrast and highly detailed real-time images for failure analysis. The detailed X-ray image is capable of inspecting interconnection wires on IC as well as pin point defects such as solder joint shorts, opens and voids.

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We will get back to you in 2-4 working days through email with the qoutation enquiry. For urgent enquiries, do contact us directly.