Contact Number:
(+65) 62881246
Email:
sales@intech-technologies.com
Address
20 Woodland Links #07-07 SG(738733)
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Dicing Services
WAFER DICING
Die Sort
Assembly Services
WAFER BACKGRINDING | WAFER THINNING
Die Bond
Wire Bonding
Flip Chip Bonding
SEM
X-Ray
Die Shear | Wire Pull
Packaging Services
Packaging Molding (Encapsulation)
Low Profile Quad Flat Package (LQFP)
Quad Flat No Lead Package (QFNL)
Contact Us
Shop
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Home
About Us
Services
Dicing Services
WAFER DICING
Die Sort
Assembly Services
WAFER BACKGRINDING | WAFER THINNING
Die Bond
Wire Bonding
Flip Chip Bonding
SEM
X-Ray
Die Shear | Wire Pull
Packaging Services
Packaging Molding (Encapsulation)
Low Profile Quad Flat Package (LQFP)
Quad Flat No Lead Package (QFNL)
Contact Us
Shop
Home
About Us
Services
Dicing Services
WAFER DICING
Die Sort
Assembly Services
WAFER BACKGRINDING | WAFER THINNING
Die Bond
Wire Bonding
Flip Chip Bonding
SEM
X-Ray
Die Shear | Wire Pull
Packaging Services
Packaging Molding (Encapsulation)
Low Profile Quad Flat Package (LQFP)
Quad Flat No Lead Package (QFNL)
DICING SERVICES
WAFER DICING
DIE SORT
PACKAGING SERVICES
PACKAGE MOLDING ENCAPSULATION
LOW PROFILE QUAD FLAT PACKAGE (LQFP)
QUAD FLAT NO LEAD PACKAGE (QFNL)
ASSEMBLY SERVICES
WAFER BACKGRINDING | WAFER THINNING
DIE BOND
WIRE BONDING
FLIP CHIP BONDING
SEM
X-RAY
DIE SHEAR | WIRE PULL
Contact Us
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Wafer Backgrinding | Wafer Thinning
Assembly Services
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