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Die Bond

Following wafer dicing, INTECH can assemble your dies into open cavity plastic or ceramic substrate. We provide standard die bonding services using adhesive based on your requirements. On top of that, INTECH supplies flip-chip, stacked die and chip on board assembly capability. We also provide customized labeling and barcoding on chips for your specific needs.


We will get back to you in 2-4 working days through email with the qoutation enquiry. For urgent enquiries, do contact us directly.