Plastic Packages

Plastic package manufacturing for mass volume production is a widely utilized method in the semiconductor industry. By employing lead frames and plastic molding techniques, a variety of package types, including QFN (Quad Flat No-Lead), SOIC (Small Outline Integrated Circuit), QFP (Quad Flat Package), TQFP (Thin Quad Flat Package), PDIP (Plastic Dual In-Line Package), PLCC (Plastic Leaded Chip Carrier), and TSOP (Thin Small Outline Package), can be efficiently manufactured. This introduction provides an overview of the manufacturing process, highlighting the use of lead frames and plastic molding to meet the high-volume production requirements of the industry.



Tooling is a fundamental aspect of plastic package manufacturing. It involves designing and producing the necessary tools and equipment for various stages of the process. This includes:

Lead Frame Design and Production Tooling: Tools used to create the lead frames based on the design specifications, such as stamping dies, etching plates, or photoresist masks.

Mold Tool Design and Production: Tools required for molding the plastic encapsulant, including the mold cavities and associated features specific to each package type.

Molding Equipment: Specialized equipment used during the molding process, such as transfer molding machines that apply heat and pressure to inject the plastic encapsulant into the mold cavities.

II. Lead Frame Design and Production:

Lead frame design is a critical initial step in the manufacturing process. It involves creating precise designs for the metal structures that provide structural support and electrical pathways for the semiconductor devices. The lead frame production process employs techniques such as stamping, etching, or photo-etching to manufacture the lead frames according to the design specifications.

III. Die Attach:

Die attach is a crucial process where the semiconductor die is securely bonded to the lead frame. The die attach step ensures proper alignment and electrical connection between the die and the lead frame. Various techniques and materials, such as adhesive materials or soldering, may be employed depending on the specific requirements of the package.

IV. Wire Bonding:

Wire bonding establishes electrical connections between the die and the lead frame. It enables signal transmission from the die to the external circuits. Wire bonding techniques, such as ball-wedge or wedge-wedge bonding, are utilized to create reliable electrical connections using fine wires made of materials like gold or copper.

V. Molding:

The molding process encapsulates the lead frame, die, and wire bonds with a protective plastic compound. This step ensures the physical and environmental protection of the semiconductor device. The plastic encapsulant is injected under pressure into a mold cavity created by the mold tool, which is then solidified, forming the final package.

VI. Marking:

Marking plays a crucial role in identifying and providing essential information about the package. This step involves laser or inkjet printing of part numbers, logos, date codes, and other relevant information on the package. The marking helps with identification and traceability of the manufactured packages.

VII. Trim and Form (for select package types):

For certain package types, such as those requiring lead customization, a trim and form process is employed. This step involves cutting the leads to their final length and shaping them into their desired configuration. Trim and form ensures compatibility with surface-mount technology (SMT) and facilitates the efficient assembly of the packages onto printed circuit boards.

By ensuring proper tooling and following these essential process steps, semiconductor manufacturers can efficiently produce a variety of plastic packages for mass volume production, meeting the demands of the industry while maintaining high quality and reliability.

Open Cavity/ Air cavity Packages

We specialize in the assembly of open cavity packages, ensuring the encapsulation of integrated circuits (ICs) for optimal performance and protection. Our expertise extends beyond package assembly to include lid assembly, providing a complete solution for encapsulation needs.

Working with ceramic and plastic materials, we carefully construct open cavity packages that offer excellent thermal dissipation, electrical insulation, and mechanical strength. Whether it’s managing heat efficiently with ceramic packages or cost-effective solutions with plastic packages, we tailor our approach to meet specific requirements.

Additionally, we excel in lid assembly, a critical step in encapsulation. Our skilled technicians meticulously align and securely attach the lid to the package, ensuring the protection and integrity of the delicate die and wire connections. With precise adhesives or soldering techniques, we create a robust seal against environmental factors and contaminants.

Our open cavity package assembly, combined with meticulous lid assembly, delivers a comprehensive solution for encapsulating ICs. Whether you require encapsulation for low volume jobs or larger projects, our focus on quality and attention to detail ensures reliable and high-quality results.

Package Assembly Process:

Our package assembly process includes essential steps to ensure the successful encapsulation of integrated circuits (ICs) within open cavity packages. Here is an overview of the key stages involved:

Die Attach:

During this crucial step, the IC die is precisely attached to the open cavity package. Utilizing advanced techniques and equipment, we ensure accurate alignment and secure bonding between the die and the package. This step establishes reliable electrical connections and sets the foundation for optimal IC performance.

Wire Bonding:

Next, we establish essential electrical connections between the die and the package leads. Our experienced technicians employ advanced wire bonding techniques, such as wedge bonding or wire bonding, to establish secure and robust electrical connections. This ensures efficient signal transmission and functionality of the IC.

Encapsulation (Lid Assembly):

The encapsulation stage involves sealing the open cavity package to protect the delicate die and wire connections from external contaminants and environmental factors. The lid assembly process is carried out with meticulous care, aligning and securely attaching the lid to the package. Through precise adhesives or soldering techniques, we create a robust seal, ensuring the integrity and longevity of the encapsulated IC.


To enable easy identification and traceability, we incorporate a marking process that ensures clear and permanent identification on the package surface. Through advanced laser marking technology, we imprint relevant information such as part numbers, lot codes, and manufacturer logos onto the package. This meticulous marking process guarantees accurate identification and seamless integration into inventory management and quality control systems.

At every stage of the package assembly process, we prioritize quality control and utilize state-of-the-art equipment to ensure precision and reliability. Our skilled technicians possess extensive expertise in package assembly, enabling us to deliver high-quality encapsulation solutions tailored to meet the specific requirements of our customers.

Please note that our package assembly process may vary depending on the project requirements and package type. We are committed to adapting our processes to accommodate your unique needs and deliver exceptional results.

Open Cavity Package Types:

Our comprehensive package assembly services cover a broad range of open cavity package types. Alongside the well-known CSP (Chip Scale Package) and WLP (Wafer-Level Package), we specialize in assembling the following popular package types:

QFN (Quad Flat No-Lead)

DFN (Dual Flat No-Lead)

SON (Small Outline No-Lead)

MLP (Micro Leadframe Package)

LGA (Land Grid Array)

BGA (Ball Grid Array)

QFP (Quad Flat Package)

SOP (Small Outline Package)

SSOP (Shrink Small Outline Package)

PLCC (Plastic Leaded Chip Carrier)

With our comprehensive open cavity package assembly services, we offer a reliable and efficient solution for semiconductor manufacturing. By leveraging our expertise in wafer prep and package assembly, we ensure that your ICs are encapsulated within high-quality open cavity packages, providing optimal performance, protection, and thermal dissipation. Partner with us to benefit from our state-of-the-art facility, skilled technicians, and a diverse range of package types. Experience the reliability and durability of our open cavity package assembly services for your semiconductor needs.

Lid Assembly Services

Intech Technologies is a trusted provider of semiconductor packaging solutions, offering a wide range of advanced services to meet the diverse needs of the industry. We specialize in lid assembly for open cavity plastic packages, providing customized solutions for both ceramic and plastic lids. With our expertise and state-of-the-art facilities, we ensure the highest quality and reliability for your lid assembly requirements.


Importance of Lid Assembly

Lid assembly is a critical process in semiconductor packaging, as it provides protection and environmental isolation for delicate electronic components. By sealing the open cavities of plastic packages with lids, we safeguard the internal components from moisture, dust, contaminants, and other external factors that could affect their performance and reliability.

Ceramic Lids for Enhanced Protection

Ceramic lids offer superior protection due to their excellent thermal and mechanical properties. They are highly resistant to temperature fluctuations, moisture, and chemical exposure, making them ideal for applications that require enhanced reliability and durability. Our lid assembly services include precision placement and bonding of ceramic lids, ensuring a hermetic seal and optimal protection for your semiconductor devices.

Plastic Lids for Cost-Effective Solutions

Plastic lids provide a cost-effective alternative for lid assembly, particularly for applications where stringent environmental conditions are not a concern. We offer a wide range of plastic lid options, including thermoplastic materials such as epoxy molding compounds (EMC) and other polymers. Our experienced technicians ensure precise placement and bonding of plastic lids, maintaining the integrity of your packaged devices.

Customized Lid Assembly Solutions

At Intech, we understand that every application has unique requirements, and our lid assembly services are tailored to meet your specific needs. Whether you require hermetic sealing, low-profile lids, or specific material compatibility, we have the expertise to provide customized solutions that offer exceptional protection and reliability.

Quality Assurance and Reliability

Quality is of paramount importance in lid assembly, as it directly impacts the performance and longevity of your packaged devices. At Intech, we adhere to stringent quality control processes throughout the lid assembly process. Our advanced equipment, skilled technicians, and comprehensive testing ensure that the lids are accurately placed, securely bonded, and provide reliable protection against external factors.

Applications of Lid Assembly

Lid assembly finds applications in various industries, including automotive, aerospace, telecommunications, consumer electronics, and medical devices. It is commonly used for packaging integrated circuits (ICs), sensors, microcontrollers, and other semiconductor devices that require environmental protection and long-term reliability.

Environmental Considerations

Intech is committed to environmentally responsible practices. We offer eco-friendly lid assembly options, including the use of recyclable materials and adherence to regulatory standards for hazardous substances. Our goal is to provide sustainable solutions that meet both performance requirements and environmental stewardship.

Intech Technologies offers comprehensive lid assembly services for open cavity plastic packages, providing effective protection and reliability for your semiconductor devices. Whether you require ceramic lids for enhanced durability or cost-effective plastic lids, we have the expertise and capabilities to deliver customized solutions. With our commitment to quality, precision, and environmental responsibility, you can trust us for all your lid assembly needs. Experience the excellence and reliability that Intech Technologies offers in semiconductor packaging.

Epoxy Encapsulation Services

Intech Technologies is a leading provider of semiconductor assembly and packaging solutions, offering a wide range of advanced services to meet the diverse needs of the industry. One of our key offerings is epoxy encapsulation, a crucial process in semiconductor packaging that provides protection, environmental isolation, and mechanical support to delicate electronic components. With our expertise in epoxy encapsulation, we ensure the highest quality and reliability for your encapsulation needs.

Importance of Epoxy Encapsulation

Epoxy encapsulation plays a critical role in safeguarding semiconductor devices from various environmental factors such as moisture, dust, temperature fluctuations, and physical stress. By encapsulating the chips or components with epoxy, we create a protective barrier that enhances their durability, extends their lifespan, and improves their overall performance.

Epoxy Encapsulation Process

At Intech, we employ advanced techniques and state-of-the-art equipment to carry out epoxy encapsulation with utmost precision and efficiency. The process typically involves the following steps:

    1. Material Selection: 

We carefully choose epoxy resins with appropriate properties, such as thermal conductivity, electrical insulation, adhesion, and resistance to moisture and chemicals, based on the specific requirements of your application.

    1. Dispensing: 

The epoxy resin is dispensed onto the semiconductor device, ensuring uniform coverage and minimal voids or air bubbles.

    1. Curing: 

The encapsulated device is then subjected to a controlled curing process, which involves heating the epoxy to a specific temperature and time to achieve optimal hardness and stability.

    1. Trimming and Finishing:

Once cured, the encapsulated device undergoes trimming and finishing processes to ensure precise dimensions and a clean, professional appearance.

Customized Encapsulation Solutions:

We understand that every application has unique requirements, and our epoxy encapsulation services are tailored to meet your specific needs. Whether you require standard epoxy encapsulation, low-stress encapsulation, or hermetic sealing, we have the expertise to provide customized solutions that offer exceptional protection and reliability.

Quality Assurance and Reliability

At Intech, we adhere to rigorous quality standards throughout the epoxy encapsulation process. Our highly skilled technicians and advanced equipment enable us to achieve consistent encapsulation results with tight tolerances. We also conduct comprehensive quality control tests and inspections to ensure that the encapsulated devices meet the highest standards of reliability and performance.

Applications of Epoxy Encapsulation

Epoxy encapsulation finds applications in various industries, including automotive, aerospace, telecommunications, consumer electronics, and medical devices. It is commonly used for encapsulating integrated circuits (ICs), sensors, MEMS devices, discrete components, and other semiconductor devices that require protection from harsh operating conditions.

Intech Technologies offers comprehensive epoxy encapsulation services that provide effective protection and enhanced reliability for your semiconductor devices. With our advanced techniques, customized solutions, and stringent quality control, we ensure that your encapsulated components meet the highest standards of performance and durability. Trust us for all your epoxy encapsulation needs, and experience the expertise and excellence that Intech Technologies offers.

Low-K Laser Grooving Solutions

Intech offers an advanced low-K grooving solution that enables high-quality cuts with laser grooving technology. Our capabilities in low-K grooving allow us to provide precise and efficient processing of low-k films, ensuring excellent results without the risk of film peeling or damage. With our state-of-the-art laser grooving equipment and expertise, we deliver superior performance and reliability for your semiconductor manufacturing needs.

Mechanical Strength of Low-K Film

The low-K film used as an insulating layer in high-speed logic applications often has low mechanical strength, making it susceptible to film peeling during the traditional blade dicing process. Our low-K grooving solution effectively removes the wiring layer, including the low-K film, using advanced laser grooving equipment. This process ensures the integrity of the low-K film while achieving accurate cuts and preventing any damage or peeling.

Intech Technologies’ Laser Grooving Process

Our DFL7161 fully-automatic laser saw is specifically designed for low-K grooving applications. This equipment utilizes a pulse laser for non-thermal processing, ensuring precise and controlled grooving of low-K films. Whether you require “Pi Laser Grooving” or “Omega Laser Grooving,” our laser grooving solution delivers excellent throughput while minimizing chipping, delamination, and other cut-quality issues. The laser grooving process is performed rapidly and seamlessly, allowing for efficient production and consistent results.

Excellent Precision and Ease of Use

The DFL7161 laser saw is equipped with cutting-edge technology to ensure precision and ease of operation. The short pulse laser used in our grooving solution achieves high-quality processing with minimal distortion and deformation due to heating. The equipment features an LCD touch screen graphical user interface, enabling intuitive control and efficient operation. Our solution provides the reliability and performance you need for low-K grooving applications, ensuring consistent and accurate cuts every time.

Why Choose Intech Technologies for Low-K Laser Grooving Solution

  • Superior Performance

Our laser grooving technology ensures precise and clean cuts in low-K films, maintaining the integrity of the materials and enhancing overall performance.

  • Increased Efficiency 

With our efficient laser grooving process, you can achieve higher throughput and minimize production time, optimizing your semiconductor manufacturing operations.

  • Enhanced Product Quality 

The accurate and controlled grooving provided by our solution minimizes the risk of film peeling or damage, resulting in high-quality semiconductor components and improved product reliability.

Partner with Intech for your low-K grooving needs, and experience the advantages of our advanced laser grooving solution. Our expertise, state-of-the-art equipment, and commitment to excellence ensure that we deliver superior results, meeting the stringent requirements of your semiconductor manufacturing projects. Trust us to provide precise, efficient, and high-quality low-K grooving services tailored to your specific needs.

QFNL Packages

INTECH offers standard backgrinding and bumped wafer backgrinding. We use automated state-of-the-art wafer backgrinding equipment to achieve the highest level of quality available and can continuously achieve thin wafer target thicknesses up to 0.05 mm for 8” and 12” wafers. We provide bumped wafer backgrinding, standard wafer grinding, single die backgrinding, and custom wafer backgrinding all with streamlined processing time.

LQFP Packages

INTECH offers standard backgrinding and bumped wafer backgrinding. We use automated state-of-the-art wafer backgrinding equipment to achieve the highest level of quality available and can continuously achieve thin wafer target thicknesses up to 0.05 mm for 8” and 12” wafers. We provide bumped wafer backgrinding, standard wafer grinding, single die backgrinding, and custom wafer backgrinding all with streamlined processing time.

Die Shear | Wire Pull

The shear system has a unique ‘programmable shear height’ feature that gives consistently accurate positioning over a wide range of height applications. The height reference is taken, prior to the shear, from a soft landing of the shear tool on the substrate adjacent to the bond being tested.

The wire pull system has a range of test cartridges that allows the machine to perform bond strength over a wide range of loads.


To further enhance failure analysis where the product has been encapsulated, an X-ray system is available to provide high magnification, high contrast and highly detailed real-time images for failure analysis. The detailed X-ray image is capable of inspecting interconnection wires on IC as well as pin point defects such as solder joint shorts, opens and voids.


SEM (Scanning electron microscope) provides our customer with failure analysis and process characterization. The SEM can also produce representations of three-dimensional views from the target object and allows target surface analysis to be performed.